Marcus Pan

Dr. Marcus Pan is currently leading a strategy of AI, compute and advanced packaging productization for a large commercial firm. He has been chairing the largest IEEE/ACM design automation conference (DAC) AI and mixed-signal hardware track since 2021. He previously served as Program Manager and Science Director at the National Semiconductor Technology Center (NSTC) / Natcast and Semiconductor Research Corporation (SRC), where he led the AI-driven RFIC Design Enablement (AIDRFIC) program—part of the CHIPS Act’s ~$7B investment—facilitating ~200 technology transfers across 500+ researchers and 20 international companies. Prior to that, he managed DARPA, OUSD and AFRL integrated circuit research programs at Boeing and led mixed-signal electronics development at HRL Laboratories and Qualcomm.

He serves on several technical committees of IMS, DAC, IEEE EPS TC-EDMS and BCICTS, and co-directs TxACE. His recent panel contributions include the DOE EES2 roadmapping workshop, Sandia National Lab AI-codesign workshop, the ISSCC panel “The Path to Sustainable IC Ecosystem” and ChipletSummit’s “Superpanel on Co-Package Design in the Post-Moore Era.” He holds a Ph.D. in Electrical Engineering from UC San Diego and is a certified PMP.