Rahima Mohammed is Semiconductor Technical Advisor at Vinci4D.ai, where she leads cross-tier physics-intelligent modeling and AI-accelerated validation across component, package, system, and data-center domains. Her work spans multi-physics simulation — thermal, mechanical and electrical — for advanced cooling and 3D IC packaging, replacing legacy compact models with full-fidelity, manufacturing-resolution analysis for next-generation chiplet architectures.

Rahima brings 27 years of experience at Intel as a Senior Principal Engineer, where she architected breakthrough cooling innovations that improved thermal margins by over 20% for data centre SoCs, delivered $350M+ in silicon quality and validation cost savings, and championed AI/ML adoption across 850+ validation engineers. A trusted advisor to executives and customers including Apple and Meta, she led global initiatives spanning packaging, firmware, and hardware teams. A National Inventors Hall of Fame honoree (2024) with nine patents, 130+ publications, and 20+ keynotes, she served as IEEE Semi-Therm Program Chair (2015) and General Chair (2016).